THERMAL MODELING OF SEMICONDUCTOR DEVICES AND VALIDATION
Keywords:
Thermal modeling, semiconductor devices, finite element analysis, thermal resistance, junction temperature, experimental validation, compact thermal modelsAbstract
The continuous miniaturization of semiconductor devices, coupled with increased operatingfrequencies and higher power densities, has made thermal management a critical challenge inmodern electronic systems. Excessive temperature rise within semiconductor junctions adversely affects device
References
Bar-Cohen, A., Maurer, J.J. and Felbinger, J.G. (2015) 'DARPA's intra/interchip enhanced cooling (ICECool) program', CS MANTECH Conference Proceedings, pp. 171-174.
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Published
2024-05-15
How to Cite
Preethi Elizabeth Iype,Dr. V. Suresh Babu Principal,Balasaheb Hanumantrao Pati. (2024). THERMAL MODELING OF SEMICONDUCTOR DEVICES AND VALIDATION. Journal of Computational Analysis and Applications (JoCAAA), 33(05), 3276–3290. Retrieved from https://www.eudoxuspress.com/index.php/pub/article/view/4458
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